This particular product had to be designed not only to meet its primary electronic and mechanical objectives but also to dissipate thermal loads from the powerful electronics that were anticipated to be unusually high.

This warranted numerous thermal calculations when placing electronic components and designing the mechanical panels to which the PCBs (printed circuit boards) would be mounted.

The thermal requirements also affected mechanical design as each custom thermal conductor (heatsink) had to confoorm to manufacturing, assembly, and service requirements as well.