This particular product had to be designed not only to meet its primary electronic and mechanical objectives but also to dissipate thermal loads from the powerful electronics that were anticipated to be unusually high.

This warranted numerous thermal calculations when placing electronic components and designing the mechanical panels to which the PCBs (printed circuit boards) would be mounted.

The thermal requirements also affected mechanical design as each custom thermal conductor (heatsink) had to conform to manufacturing, assembly, and service requirements as well.

And, Lean design principles were applied throughout the design lifecycle of all components to ensure simplified manufacturing methods could be sought making it easier to find vendors to fabricate each component with relative ease.